(footprint "_0402MP" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 0)
  (descr "<b>0402 MicroPitch<p>")
  (fp_text reference "REF**" (at -0.635 -0.4763) (layer "B.SilkS")
    (effects (font (size 0.499872 0.499872) (thickness 0.109728)) (justify left bottom))
    (tstamp c4cab9c5-d6e5-4660-b910-603a51b56783)
  )
  (fp_text value ">VALUE" (at -0.635 0.7938) (layer "B.Fab")
    (effects (font (size 0.36576 0.36576) (thickness 0.04064)) (justify left bottom))
    (tstamp 6ffdf05e-e119-49f9-85e9-13e4901df42a)
  )
  (fp_line (start 0 -0.127) (end 0 0.127) (layer "B.SilkS") (width 0.2032) (tstamp eb8d02e9-145c-465d-b6a8-bae84d47a94b))
  (fp_line (start -0.245 -0.174) (end 0.245 -0.174) (layer "B.Fab") (width 0.1016) (tstamp 4c843bdb-6c9e-40dd-85e2-0567846e18ba))
  (fp_line (start 0.245 0.174) (end -0.245 0.174) (layer "B.Fab") (width 0.1016) (tstamp 72b36951-3ec7-4569-9c88-cf9b4afe1cae))
  (fp_poly (pts
      (xy 0.2588 0.25)
      (xy 0.5 0.25)
      (xy 0.5 -0.25)
      (xy 0.2588 -0.25)
    ) (layer "B.Fab") (width 0) (fill solid) (tstamp 0a1a4d88-972a-46ce-b25e-6cb796bd41f7))
  (fp_poly (pts
      (xy -0.5 0.25)
      (xy -0.254 0.25)
      (xy -0.254 -0.25)
      (xy -0.5 -0.25)
    ) (layer "B.Fab") (width 0) (fill solid) (tstamp 36d783e7-096f-4c97-9672-7e08c083b87b))
  (pad "1" smd rect (at -0.508 0) (size 0.5 0.5) (layers "B.Cu" "B.Paste" "B.Mask")
    (solder_mask_margin 0.0635) (tstamp 29bb7297-26fb-4776-9266-2355d022bab0))
  (pad "2" smd rect (at 0.508 0) (size 0.5 0.5) (layers "B.Cu" "B.Paste" "B.Mask")
    (solder_mask_margin 0.0635) (tstamp cb6062da-8dcd-4826-92fd-4071e9e97213))
)