(footprint "MICROBUILDER__0805MP" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 0)
  (descr "<b>0805 MicroPitch</b>")
  (fp_text reference "REF**" (at -1.5875 -0.9525) (layer "B.SilkS")
    (effects (font (size 0.666496 0.666496) (thickness 0.146304)) (justify left bottom))
    (tstamp 290c753b-3b9b-4c45-85a5-65bd9eae1f9e)
  )
  (fp_text value ">VALUE" (at -1.5875 1.27) (layer "B.Fab")
    (effects (font (size 0.36576 0.36576) (thickness 0.04064)) (justify left bottom))
    (tstamp 8a0095e3-f64e-4bc6-8d5a-1cdcee192b11)
  )
  (fp_line (start 0 -0.508) (end 0 0.508) (layer "B.SilkS") (width 0.2032) (tstamp cec22d4a-eda3-4d50-8609-c3a123c120be))
  (fp_line (start -0.51 0.535) (end 0.51 0.535) (layer "B.Fab") (width 0.1016) (tstamp 6a5b3eea-de35-4a54-8316-e56ea2a634e4))
  (fp_line (start -0.51 -0.535) (end 0.51 -0.535) (layer "B.Fab") (width 0.1016) (tstamp d4f9d898-7a83-4186-a9d6-9da79adbdd19))
  (fp_poly (pts
      (xy 0.4064 0.65)
      (xy 1 0.65)
      (xy 1 -0.65)
      (xy 0.4064 -0.65)
    ) (layer "B.Fab") (width 0) (fill solid) (tstamp 05c4a04b-0442-4e18-9747-3d9fc4a562fe))
  (fp_poly (pts
      (xy -1 0.65)
      (xy -0.4168 0.65)
      (xy -0.4168 -0.65)
      (xy -1 -0.65)
    ) (layer "B.Fab") (width 0) (fill solid) (tstamp 7a332b0c-4cba-438b-85c1-9efe2690fb62))
  (pad "1" smd rect (at -1.016 0) (size 1.2 1.3) (layers "B.Cu" "B.Paste" "B.Mask")
    (solder_mask_margin 0.0635) (tstamp da7eee34-4516-4154-9034-7c9b8e2afe41))
  (pad "2" smd rect (at 1.016 0) (size 1.2 1.3) (layers "B.Cu" "B.Paste" "B.Mask")
    (solder_mask_margin 0.0635) (tstamp 1c4dfe58-85b1-467f-8e9d-bdb7a0d0ca8e))
)