(footprint "_0805MP" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 0)
  (descr "<b>0805 MicroPitch</b>")
  (fp_text reference "REF**" (at -1.5875 -0.9525) (layer "F.SilkS")
    (effects (font (size 0.666496 0.666496) (thickness 0.146304)) (justify left bottom))
    (tstamp 2a424d49-c147-4660-897f-5d8b5a600ef8)
  )
  (fp_text value ">VALUE" (at -1.5875 1.27) (layer "F.Fab")
    (effects (font (size 0.36576 0.36576) (thickness 0.04064)) (justify left bottom))
    (tstamp ed8d61c7-81ff-4359-9f3f-c5a20c41ec95)
  )
  (fp_poly (pts
      (xy -0.1999 0.5001)
      (xy 0.1999 0.5001)
      (xy 0.1999 -0.5001)
      (xy -0.1999 -0.5001)
    ) (layer "F.Adhes") (width 0) (fill solid) (tstamp 88b745d5-0fa5-45c2-9f49-45777e2101eb))
  (fp_line (start 0 -0.508) (end 0 0.508) (layer "F.SilkS") (width 0.2032) (tstamp 917f0969-de2b-4000-a1f3-35802d197eb9))
  (fp_line (start -0.51 -0.535) (end 0.51 -0.535) (layer "F.Fab") (width 0.1016) (tstamp e8212835-1d52-4356-9006-b2b0d8582465))
  (fp_line (start -0.51 0.535) (end 0.51 0.535) (layer "F.Fab") (width 0.1016) (tstamp efa002e8-621d-41f0-9014-a7bebf57a1bc))
  (fp_poly (pts
      (xy -1 0.65)
      (xy -0.4168 0.65)
      (xy -0.4168 -0.65)
      (xy -1 -0.65)
    ) (layer "F.Fab") (width 0) (fill solid) (tstamp 50c72ddf-2e76-4924-a119-49c7065a3067))
  (fp_poly (pts
      (xy 0.4064 0.65)
      (xy 1 0.65)
      (xy 1 -0.65)
      (xy 0.4064 -0.65)
    ) (layer "F.Fab") (width 0) (fill solid) (tstamp 6eb6d3db-850e-49e8-ad5d-1a9ff95db9e1))
  (pad "1" smd rect (at -1.016 0) (size 1.2 1.3) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.0508) (tstamp 7fce1d1a-f291-4b7e-8e8a-4dd4a21a2ccc))
  (pad "2" smd rect (at 1.016 0) (size 1.2 1.3) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.0508) (tstamp a9b28934-e66e-46c9-aee5-fb95015d5ea9))
)