(footprint "SW_EVP-BB1AAB000" (version 20211014) (generator pcbnew) (layer "F.Cu") (tedit 0) (fp_text reference "REF**" (at -2.628409 -1.50195) (layer "B.SilkS") (effects (font (size 1.169909 1.169909) (thickness 0.101731)) (justify left bottom)) (tstamp 3eee2221-7af9-4d6a-ba79-a48c3fd1ac35) ) (fp_text value ">VALUE" (at -2.629818 3.005518) (layer "B.Fab") (effects (font (size 1.170545 1.170545) (thickness 0.101786)) (justify left bottom)) (tstamp 44c331f8-33e4-4ba1-bb1e-3071cc175bfd) ) (fp_poly (pts (xy -1.095 0.605) (xy -1.555 0.605) (xy -1.555 0.145) (xy -1.095 0.145) ) (layer "B.Paste") (width 0) (fill solid) (tstamp 0e852933-f119-4b7f-a503-b829e02656a9)) (fp_poly (pts (xy -1.095 -0.145) (xy -1.555 -0.145) (xy -1.555 -0.605) (xy -1.095 -0.605) ) (layer "B.Paste") (width 0) (fill solid) (tstamp 7b694997-43fc-41fd-818b-681c539b1571)) (fp_poly (pts (xy 1.555 -0.145) (xy 1.095 -0.145) (xy 1.095 -0.605) (xy 1.555 -0.605) ) (layer "B.Paste") (width 0) (fill solid) (tstamp 96cc7009-e5c2-4181-9848-d145b9196cc4)) (fp_poly (pts (xy 1.555 0.605) (xy 1.095 0.605) (xy 1.095 0.145) (xy 1.555 0.145) ) (layer "B.Paste") (width 0) (fill solid) (tstamp e208ea3a-d990-4992-b395-c95b18b77f83)) (fp_line (start -1.3 0.9635) (end 1.3 0.9635) (layer "B.SilkS") (width 0.127) (tstamp 6150d77e-0e79-4609-a9ad-f39ba34a63b4)) (fp_line (start -1.3 -0.9635) (end 1.3 -0.9635) (layer "B.SilkS") (width 0.127) (tstamp b4203b01-a27f-440d-ad64-759637213d6e)) (fp_line (start 1.3 -0.8) (end 1.3 0.8) (layer "B.Fab") (width 0.127) (tstamp 4e1a7683-466d-4d67-bce5-496395f4b0d5)) (fp_line (start -1.3 -0.8) (end 1.3 -0.8) (layer "B.Fab") (width 0.127) (tstamp 73486422-c87a-4ad4-8fe5-a3ffc70cb20a)) (fp_line (start -1.3 0.8) (end -1.3 -0.8) (layer "B.Fab") (width 0.127) (tstamp 85a22866-16c5-4384-bc0b-22ed5b68a467)) (fp_line (start 1.3 0.8) (end -1.3 0.8) (layer "B.Fab") (width 0.127) (tstamp a559f63f-b3a0-4b81-aa6a-605d4da47af6)) (pad "A1" smd rect (at -1.325 -0.375) (size 0.55 0.55) (layers "B.Cu" "B.Mask") (solder_mask_margin 0.0635) (tstamp eec607c7-6f4a-49f4-b728-3da8374be4ce)) (pad "A2" smd rect (at -1.325 0.375) (size 0.55 0.55) (layers "B.Cu" "B.Mask") (solder_mask_margin 0.0635) (tstamp aaa13f87-8acd-40d7-bdde-65d39b0b7892)) (pad "B1" smd rect (at 1.325 -0.375) (size 0.55 0.55) (layers "B.Cu" "B.Mask") (solder_mask_margin 0.0635) (tstamp 260f62f6-a6cf-45e0-9208-51504e701f69)) (pad "B2" smd rect (at 1.325 0.375) (size 0.55 0.55) (layers "B.Cu" "B.Mask") (solder_mask_margin 0.0635) (tstamp 38c40dcc-c1da-4f6f-a147-01497313c7b0)) )