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Specify firmware partition format by compatible string.
formats in ramips:
- denx,uimage
- tplink,firmware
- seama
It's unlikely but the firmware splitting might not work any longer for
the following boards, due to a custom header:
- EX2700: two uImage headers
- BR-6478AC-V2: edimax-header
- 3G-6200N: edimax-header
- 3G-6200NL: edimax-header
- BR-6475ND: edimax-header
- TEW-638APB-V2: umedia-header
- RT-N56U: mkrtn56uimg
But it rather looks like the uImage splitter is fine with the extra
header.
The following dts are not touched, due to lack of a compatible string in
the matching firmware splitter submodule:
- CONFIG_MTD_SPLIT_JIMAGE_FW
DWR-116-A1.dts
DWR-118-A2.dts
DWR-512-B.dts
DWR-921-C1.dts
LR-25G001.dts
- CONFIG_MTD_SPLIT_TRX_FW
WCR-1166DS.dts
WSR-1166.dts
- CONFIG_MTD_SPLIT_MINOR_FW
RBM11G.dts
RBM33G.dts
- CONFIG_MTD_SPLIT_LZMA_FW
AR670W.dts
- CONFIG_MTD_SPLIT_WRGG_FW
DAP-1522-A1.dts
Signed-off-by: INAGAKI Hiroshi <musashino.open@gmail.com>
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Use diag.sh version used for other targets supporting different leds
for the different boot states.
The existing led sequences should be the same as before.
Signed-off-by: Mathias Kresin <dev@kresin.me>
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Starting with kernel 4.4, the use of partitions as direct subnodes of the
mtd device is discouraged and only supported for backward compatiblity
reasons.
Signed-off-by: Alex Maclean <monkeh@monkeh.net>
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Use partition@ as name for all partition nodes. Add a label where
necessary.
Signed-off-by: Mathias Kresin <dev@kresin.me>
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Fix individual boards dtc warnings or obvious mistakes.
Signed-off-by: Mathias Kresin <dev@kresin.me>
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Also fix several typos in led node name.
Signed-off-by: Chuanhong Guo <gch981213@gmail.com>
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Use the GPIO dt-bindings macros and add compatible strings in the
ramips device tree source files.
Signed-off-by: L. D. Pinney <ldpinney@gmail.com>
Signed-off-by: Mathias Kresin <dev@kresin.me>
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All compiled device tree files not mentioned are binary identical to the
former ones.
Fix the obvious decimal/hex confusion for the power key of ramips/M2M.dts.
Due to the include of the input binding header, the BTN_* node names in:
- ramips/GL-MT300A.dts
- ramips/GL-MT300N.dts
- ramips/GL-MT750.dts
- ramips/Timecloud.dts
will be changed by the compiler to the numerical equivalent.
Move the binding include of lantiq boards to the file where they are
used the first time to hint the user where the values do come from.
Signed-off-by: Mathias Kresin <dev@kresin.me>
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Add node aliases to dtsi files.
Reword dts files so they're more in-line with upstream.
Fix some more warnings and errors reported by dtc
Signed-off-by: Stanislav Galabov <sgalabov@gmail.com>
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be done properly for the entire device trees.
Signed-off-by: Stanislav Galabov <sgalabov@gmail.com>
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The following patch fixes:
* wrong indentations
* doubled gpio-keys-polled nodes (DIR-300-B7, DIR-320-B1, DIR-610-A1)
* duplicate spacings
* empty lines at end of files and after last child nodes
* trailing and leading whitespace
* unnecessary and commented-out code
* missing empty lines between nodes and between properties and nodes
* unnecessary empty lines between nodes properties [1]
in .dts{,i} files, for ramips target.
[1] Some of empty lines in SOCs dtsi files were left untouched, because they seem to be there for a reason (readability?).
Signed-off-by: Piotr Dymacz <pepe2k@gmail.com>
SVN-Revision: 46613
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Signed-off-by: Claudio Leite <leitec@staticky.com>
SVN-Revision: 40549
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