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path: root/target/linux/bcm27xx/patches-5.4/950-0316-kbuild-Allow-.dtbo-overlays-to-be-built-piecemeal.patch
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* kernel: bump 5.4 to 5.4.48Petr Štetiar2020-06-221-1/+1
| | | | | | | | | | | | | | | | Resolved merge conflict in the following patches: layerscape: 701-net-0213-dpaa2-eth-Add-CEETM-qdisc-support.patch ramips: 0013-owrt-hack-fix-mt7688-cache-issue.patch Refreshed patches, removed upstreamed patch: bcm63xx: 020-v5.8-mtd-rawnand-brcmnand-fix-hamming-oob-layout.patch Run tested: qemu-x86-64 Build tested: x86/64 Signed-off-by: Petr Štetiar <ynezz@true.cz>
* kernel: bump 5.4 to 5.4.43Petr Štetiar2020-06-021-1/+1
| | | | | | | | | | | Refreshed patches, removed upstreamed patch: bcm27xx: 950-0642-component-Silence-bind-error-on-EPROBE_DEFER.patch Run tested: qemu-x86-64 Build tested: x86/64, imx6, sunxi/a53 Signed-off-by: Petr Štetiar <ynezz@true.cz>
* bcm27xx: update to latest patches from RPi foundationÁlvaro Fernández Rojas2020-05-281-0/+36
Also removes random module and switches to new bcm2711 thermal driver. Boot tested on RPi 4B v1.1 4G. Signed-off-by: Álvaro Fernández Rojas <noltari@gmail.com>