Commit message (Collapse) | Author | Age | Files | Lines | |
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* | ath79: rename 'engenius' Makefile definitions to 'senao' | Michael Pratt | 2021-02-24 | 1 | -33/+0 |
| | | | | | | | | | | | | | | | | These recipes and definitions can apply to devices from other vendors with PCB boards or SDK produced by Senao not only the brand Engenius possible examples: Extreme Networks, WatchGuard, OpenMesh, Fortinet, ALLNET, OCEDO, Plasma Cloud, devolo, etc. so rename all of these items and move DEVICE_VENDOR from common to generic/tiny.mk Signed-off-by: Michael Pratt <mcpratt@pm.me> | ||||
* | ath79: move small-flash Engenius boards to tiny | Michael Pratt | 2021-01-07 | 1 | -0/+33 |
This moves some of the Engenius boards from generic to tiny: - EAP350 v1 - ECB350 v1 - ENH202 v1 For these, factory.bin builds are already failing on master branch because of the unique situation for these boards: - 8 MB flash - an extra "failsafe" image for recovery - TFTP does not work (barely possible with 600 MTU) - bootloader loads image from a longer flash offset - 1 eraseblock each needed for OKLI kernel loader and fake rootfs - using mtd-concat to make use of remaining space... The manual alternative would be removing the failsafe partition. However this comes with the risk of extremely difficult recovery if a flash ever fails because TFTP on the bootloader is bugged. Signed-off-by: Michael Pratt <mcpratt@pm.me> [improve commit message] Signed-off-by: Adrian Schmutzler <freifunk@adrianschmutzler.de> |