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* ath79: rename 'engenius' Makefile definitions to 'senao'Michael Pratt2021-02-241-33/+0
| | | | | | | | | | | | | | | | These recipes and definitions can apply to devices from other vendors with PCB boards or SDK produced by Senao not only the brand Engenius possible examples: Extreme Networks, WatchGuard, OpenMesh, Fortinet, ALLNET, OCEDO, Plasma Cloud, devolo, etc. so rename all of these items and move DEVICE_VENDOR from common to generic/tiny.mk Signed-off-by: Michael Pratt <mcpratt@pm.me>
* ath79: move small-flash Engenius boards to tinyMichael Pratt2021-01-071-0/+33
This moves some of the Engenius boards from generic to tiny: - EAP350 v1 - ECB350 v1 - ENH202 v1 For these, factory.bin builds are already failing on master branch because of the unique situation for these boards: - 8 MB flash - an extra "failsafe" image for recovery - TFTP does not work (barely possible with 600 MTU) - bootloader loads image from a longer flash offset - 1 eraseblock each needed for OKLI kernel loader and fake rootfs - using mtd-concat to make use of remaining space... The manual alternative would be removing the failsafe partition. However this comes with the risk of extremely difficult recovery if a flash ever fails because TFTP on the bootloader is bugged. Signed-off-by: Michael Pratt <mcpratt@pm.me> [improve commit message] Signed-off-by: Adrian Schmutzler <freifunk@adrianschmutzler.de>