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author | Michael Pratt <mcpratt@pm.me> | 2021-01-01 16:48:52 -0500 |
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committer | Adrian Schmutzler <freifunk@adrianschmutzler.de> | 2021-01-07 19:51:50 +0100 |
commit | 0070650df45da29a55a89922544dba6859c18f2b (patch) | |
tree | 8d39fecdb7add794f134e586b85427a059f3265f /target/linux/arc770 | |
parent | ecded5bf0908953c47933967c0046cceb3ce0ec1 (diff) | |
download | upstream-0070650df45da29a55a89922544dba6859c18f2b.tar.gz upstream-0070650df45da29a55a89922544dba6859c18f2b.tar.bz2 upstream-0070650df45da29a55a89922544dba6859c18f2b.zip |
ath79: move small-flash Engenius boards to tiny
This moves some of the Engenius boards from generic to tiny:
- EAP350 v1
- ECB350 v1
- ENH202 v1
For these, factory.bin builds are already failing on master
branch because of the unique situation for these boards:
- 8 MB flash
- an extra "failsafe" image for recovery
- TFTP does not work (barely possible with 600 MTU)
- bootloader loads image from a longer flash offset
- 1 eraseblock each needed for OKLI kernel loader and fake rootfs
- using mtd-concat to make use of remaining space...
The manual alternative would be removing the failsafe partition.
However this comes with the risk of extremely difficult recovery
if a flash ever fails because TFTP on the bootloader is bugged.
Signed-off-by: Michael Pratt <mcpratt@pm.me>
[improve commit message]
Signed-off-by: Adrian Schmutzler <freifunk@adrianschmutzler.de>
Diffstat (limited to 'target/linux/arc770')
0 files changed, 0 insertions, 0 deletions