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| author | Robert Marko <robimarko@gmail.com> | 2018-12-16 23:06:17 +0100 |
|---|---|---|
| committer | Christian Lamparter <chunkeey@gmail.com> | 2018-12-27 14:06:38 +0100 |
| commit | c9f6116fd007ee360cbabf12ba830e3f381cee18 (patch) | |
| tree | 447799052bf934db275f0ed29b2472c486932419 /package/libs/mbedtls/Makefile | |
| parent | 30f2b2295266b0ae2e542a14ec330d6b95612921 (diff) | |
| download | upstream-c9f6116fd007ee360cbabf12ba830e3f381cee18.tar.gz upstream-c9f6116fd007ee360cbabf12ba830e3f381cee18.tar.bz2 upstream-c9f6116fd007ee360cbabf12ba830e3f381cee18.zip | |
kernel: modules: usb: Add DWC3 Qualcomm kmod
Since kernel 4.18 support for Qualcomm glue layer was
moved from DWC3 OF Simple to a separate DWC3 QCOM module.
So lets add it and make it depend on 4.19 kernel and make
sure that DWC3 OF Simple is not included if 4.19 is used.
Signed-off-by: Robert Marko <robimarko@gmail.com>
Diffstat (limited to 'package/libs/mbedtls/Makefile')
0 files changed, 0 insertions, 0 deletions